Description
878A Hot Air and Soldering Rework Station
An all-in-one solution for desoldering and soldering SMD components (QFP, SOIC, BGA, and others), with adjustable temperature and airflow.
🔧 Technical specifications
- Supply: 220 V AC ±10%, 50 Hz
- Maximum total power consumption: 700 W
- Hot-air gun: 650 W; temperature 100–480 °C; airflow up to 120 L/min
- Included nozzles: Ø 8 mm, 10 mm, and 13 mm
- Soldering iron: 50 W, AT-900M tip; temperature 200–480 °C
- Tip leakage voltage: <0.5 mV
- Display and control: LED displays for hot air and iron; rotary temperature and airflow controls; hot-air/iron selector
- Dimensions: 155 × 100 × 135 mm
- Weight: approximately 2.5 kg with accessories
💡 Typical applications
- Removing and replacing SMD components (BGA, QFP, and others)
- Precision soldering on motherboards, FPGA modules, and graphics cards
- Heat-shrink tubing
- Electronics repair, prototyping, and training workshops
- Drying and forming lightweight plastics
⚙️ Operation and settings
- Power on: Connect to mains power and switch the unit ON.
- Hot air: Select “Air” with the main control, set temperature with “Temp,” and adjust airflow with “Flow.”
- Soldering iron: Select “Iron,” set the required temperature, and wait for the display to confirm that it has reached the setpoint.
- Change tool: Move the selector to the required tool. The other settings are stored and shown again automatically.
- Shutdown and safety: Switch the main control OFF. Let the tips and nozzles cool before storage. Work in a ventilated area and wear insulating gloves.
Tip: To extend the life of the soldering tip and nozzles, clean them regularly with a damp sponge and avoid mechanical impact.
