Description
The French source URL still contains “LK-852D,” while the product listing identifies the equipment as Gordak 968. This translation follows the product name and specifications shown in the listing; the French URL remains unchanged.
Gordak 968 2-in-1 Hot-Air Rework and Soldering Station
The Gordak 968 combines a 450W hot-air handpiece and a 50W soldering iron for electronic soldering, desoldering and component replacement. The seller lists hot-air work for SMD, SOP, QFP, PLCC and BGA components, and iron work for through-hole parts, connectors, wires and rework.
Features stated by the seller
- Combined hot-air and soldering station
- Independent temperature controls for hot air and iron
- Hot-air power: 450W; soldering iron: 50W
- Maximum airflow: about 120L/min
- Electronic temperature control with PID
- Brushless fan; automatic handpiece cooling
- Standby when the handpiece is placed in its holder, depending on configuration
General specifications
- Model: Gordak 968
- Supply: 220V AC, 50Hz (seller listing)
- Separate controls for iron and hot air
Hot-air handpiece
- Heating power: 450W
- Temperature range: 100–500°C
- Maximum airflow: about 120L/min
- Brushless fan; stated noise level below 45dB
- Temperature and airflow adjustable
- Automatic cooling after heating stops; the source says airflow stops below about 100°C
Soldering iron
- Power: 50W
- Temperature range: 200–480°C
- For through-hole and SMD components, wires and connectors
- Temperature controlled independently from hot air
- Replaceable tip, subject to compatible model
Actual performance may vary with ambient temperature, nozzle and selected airflow.
Choosing the tool
| Task | Soldering iron | Hot air |
|---|---|---|
| Wire or connector soldering | Recommended | — |
| Replacing a small SMD resistor | Possible | Suitable |
| Desoldering a multi-pin IC | Difficult | Recommended |
| Installing a through-hole connector | Recommended | Less suitable |
| Heat-shrink tubing | Possible with care | Recommended |
| Removing QFP or SOP components | Difficult | Suitable |
| Precise solder rework | Suitable | Possible |
| BGA work | Specialist technique | For experienced users |
Automatic cooling
The station is described as regulating temperature during work. After hot-air heating stops, the fan continues to cool the heating element and handpiece, then stops when the temperature falls below about 100°C, according to the listing.
Example: desoldering an SMD component
- Place the board on a stable, heat-resistant support.
- Identify heat-sensitive nearby components.
- Apply flux around the component leads.
- Choose a nozzle suited to the component size.
- Start with low or moderate airflow and a temperature suited to the solder.
- Preheat gradually using circular movements and heat the leads evenly.
- When solder melts, lift the component gently with tweezers; never force it.
- Clean the pads with desoldering braid and flux, then return the handpiece to its stand.
Indicative starting settings from the source
| Task | Temperature | Airflow |
|---|---|---|
| Heat-shrink tubing | 150–250°C | Low |
| Small SMD components | 280–330°C | Low to medium |
| SOP or QFP ICs | 320–380°C | Medium |
| Lead solder with iron | 300–350°C | Not applicable |
| Lead-free solder with iron | 330–380°C | Not applicable |
These are starting points only. Suitable settings depend on solder, component size, PCB thickness and nozzle.
Use and safety
- Use suitable soldering flux and a nozzle close to the component size.
- Start with moderate temperature and airflow; keep the handpiece moving.
- Shield plastic connectors from heat. Clean and tin the iron tip before shutdown.
- Allow the cooling cycle to finish before unplugging.
- Use on a stable, non-combustible surface and a correctly grounded outlet.
- Do not touch the tip, nozzle or heating elements; keep hot air away from skin, cables and flammables.
- Ventilate the work area or use fume extraction, and wear eye protection during desoldering.
- Do not interrupt automatic cooling. Unplug before changing a tip, nozzle or heating element. Keep away from children.
Applications listed
Phone and tablet repair; motherboard, console and controller repair; power and other electronics boards; wires and connectors; LED and SMD replacement; IC desoldering; prototyping, labs, workshops and training.
