Description
XG-50 Solder Paste, Sn63/Pb37, 42 g
The source describes XG-50 solder paste for electronics repair and soldering work, including SMD and BGA processes. It lists Sn63/Pb37 alloy, a particle size of 25–45 µm and a weight of 42 g. These specifications are reproduced from the source; confirm process compatibility and handling instructions before use.
This alloy contains lead (Pb). Avoid ingestion and unnecessary skin contact, use suitable ventilation and wash hands after handling. Follow the product and workplace safety guidance.
- Listed option: XG-50 (42 g)
- Alloy: Sn63/Pb37
- Particle size listed: 25–45 µm
- Weight listed: 42 g
